GPIB AUTOMATION SOLUTION

Fengke Precision Machinery Co., Ltd. can carry out customized processing as required, rapidly manufacture various prototype parts and produce parts in small batches. We welcome your consultation at any time!

• Function-RMS

• Automatically download TestProgram, and perform RMS comparison before each run
• Specify the ProberRecipe and conduct RMS comparison before each run
• Real-time monitoring of Probe parameters, such as temperature, test OD, Probe Card Clean, etc
• Probe parameter comparison shall be conducted at the beginning of each Wafer and when the test continues after the test process is interrupted




• Function-RTM

• Real-time acquisition of test data without delay
• Real-time display of Map and yield monitoring
• Monitor the status of the Tester and the Probe in real time to prevent the abnormal Down machine from being discovered during the test
• Get the tester test data, and by Wafer counts the relevant fields




• Function-AutoContact

• The correct OD value can be measured automatically without complicated manual contact process before loading
• Improve productivity, reduce contact time from minutes to less than 6 seconds
• Support customized upper and lower limit alarm during Z-axis adjustment to avoid damaging the needle card
• Support 1-point and 5-point contact




• Function-RTM

• Through yield analysis, the probe card used by the DUT with the best yield is obtained, and the specified probe card is used for retest
• Before Reprobing, the optimal path is automatically calculated to complete the retest at the fastest speed
• Through the analysis of the BIN yield data of the previous test, retest the DIE data of a BIN
• Through the site yield analysis of the previous test, retest the site with high yield